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LTE Mini-Physical Interface Module Hardware Specifications

Table 1 provides the hardware specifications for the LTE Mini-PIM.

Table 1: LTE Mini-PIM Hardware Specifications

Description

Value

Dimensions (H x W x L)

0.80 in. x 3.75 in. x 5.9 in.(2.0 cm x 9.5 cm x 14.5 cm)

Weight

0.23 lb (0.106 kg)

Connector type

SMA

Form factor

Mini-PIM

Environmental operating temperature

32° F through 104° F (0° C through 40° C)

Storage temperature

-40° F through 158° F (-40° C through 70° C)

Relative humidity

5% to 90% noncondensing