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TCX1000-ILA Cooling System Description


The cooling system in a TCX1000-ILA consists of three 12.4-W fan modules installed in the field-replaceable unit (FRU) panel and two counter-rotating fans housed in each of the power supplies.

In the TCX1000-ILA's cooling system, cool air enters through the vents in the front panel and hot air exhausts through the fans in the FRU panel. This type of airflow is known as airflow out or front-to-back airflow. When installed, the chassis must be positioned so that the FRUs are next to the hot air exhaust.


Under normal operating conditions, the fan modules operate at a moderate speed. Temperature sensors in the chassis monitor the temperature within the chassis. The system raises an alarm if a fan module fails or if the ambient temperature inside the chassis rises above the acceptable range.

Fan Modules

The fan modules in an TCX1000-ILA are hot-removable and hot-insertable FRUs. These fan modules can be hot-swapped—you do not need to power off the TCX1000-ILA or disrupt the TCX1000-ILA function to replace a fan module. The fan module slots are numbered 0 through 2 from left to right when viewing chassis from the FRU panel side (see Figure 1 and Figure 2) shows the fan module for the TCX1000-ILA. The numbers are located on the top of the chassis.

Figure 1: Fan Numbering
Fan Numbering
Figure 2: Fan Module
Fan Module

All three fan modules must be installed for optimal operation of the TCX1000-ILA. The TCX1000-ILA can continue to function indefinitely (with appropriate alarms) when one or two of the three fans are missing. If all fans are missing, or in case of all-fan failure, the ILA raises an alarm for each fan failure, but continues operating without regard to whether the device/pump temperature exceed the alarming threshold. In all cases, when the device/pump temperature exceeds the alarming threshold, temperature alarms are raised, but ILA continues operating. This implementation is to safeguard traffic (so there is no accidental shutdown of traffic), however there is a risk of potential device damage due to overheat.