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Chassis Physical Specifications for a QFX3008-I Interconnect Device


The QFX3008-I Interconnect device is a rigid sheet-metal structure that houses the other switch components. Table 1 summarizes the physical specifications of the QFX3008-I Interconnect device.

Table 1: Physical Specifications of a QFX3008-I Interconnect Device



Chassis height

36.65 in. (93.09 cm)

Chassis width

  • 17.3 in. (43.9 cm) excluding mounting bracket width

  • 19.0 in. (48.3 cm) including mounting bracket width

Chassis depth

  • Minimum depth required for installation is 39.52 in. (100.38 cm)

  • Chassis depth without any field-replaceable units (FRUs) installed is 32.38 in. (82.25 cm)

  • Chassis depth from front-mounting brackets to rear of chassis is 35.10 in. (89.15 cm)

  • Chassis depth from mid-mounting brackets to rear of chassis is 23.73 in. (60.27 cm)

  • Maximum chassis depth with FRUs, including the optional cable manager and lockable front doors installed, is 40.37 in. (102.54 cm)


  • Chassis with midplane: Approximately 205 lb (93 kg)

  • Chassis with all FRUs: Approximately 650 lb (295 kg)

    Note: This represents the weight of the chassis including all required and optional FRUs. This does not include optical transceivers and cabling.

  • 16-port QSFP+ front card: 18.3 lb (8.3 kg)

  • Control Board: 8.4 lb (3.8 kg)

  • Rear card: 10.0 lb (4.5 kg)

  • Side fan tray: 2.7 lb (1.2 kg)

  • Front fan tray and front panel display: 16.7 lb (7.6 kg)

  • Rear fan tray: 19.4 lb (8.8 kg)

  • Power supply: 11.2 lb (5.1 kg)

  • Wiring tray: 8.0 lb (3.6 kg)