Structure Agnostic TDM over Packet (SAToP) bundles use a standards-based transport mechanism for T1/E1 circuits that allows them to interoperate with other SAToP-compliant equipment.
SAToP bundles comply with RFC 4553 to provide pseudowire encapsulation (PWE3) for TDM bit streams (T1, E1, T3, E3) that disregards any structure that may be imposed on these streams, in particular the structure imposed by the standard TDM framing.
You can configure SAToP bundles on CTP150 and CTP2000 platforms with T1/E1 interfaces or on CTP2000 platforms with serial interfaces that have T1/E1 daughter cards.
Figure 1 shows an example of SAToP encapsulation for E1 interfaces.
Figure 1: SAToP Encapsulation for E1 Interfaces
SAToP encapsulation works as follows: