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Configuring the Interface Encapsulation Type for Layer 2 Circuits

The Layer 2 encapsulation type is carried in the Label Distribution Protocol (LDP) forwarding equivalence class (FEC). You can configure either circuit cross-connect (CCC) or translational cross-connect (TCC) encapsulation types for Layer 2 circuits. For more information, see the JUNOS MPLS Applications Configuration Guide.

To configure the interface encapsulation for a Layer 2 circuit, include the encapsulation-type statement:




encapsulation-type encapsulation-type;

You can include the encapsulation-type statement at the following hierarchy levels:

[edit interfaces interface-name]
[edit logical-systems logical-system-name interfaces interface-name]

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