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Home > Support > Technical Documentation > QFX Series > QFX3000 Hardware Documentation > Cabinet Requirements for a QFX3008-I Interconnect Device
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Related Documentation

  • EX Series
  • Rack-Mounting and Cabinet-Mounting Warnings
  • QFX Series
  • Rack-Mounting and Cabinet-Mounting Warnings
  • Rack Requirements for a QFX3008-I Interconnect Device
  • Chassis Physical Specifications for a QFX3008-I Interconnect Device
 

Cabinet Requirements for a QFX3008-I Interconnect Device

You can mount a QFX3008-I Interconnect device in a cabinet that contains a 19-in. rack as defined in Cabinets, Racks, Panels, and Associated Equipment (document number EIA-310-D) published by the Electronics Industry Association.

Cabinet requirements consist of:

  • Cabinet size and clearance
  • Cabinet airflow requirements

Table 1 summarizes cabinet requirements and specifications for a QFX3008-I Interconnect device.

Table 1: Cabinet Requirements and Specifications for a QFX3008-I Interconnect Device

Cabinet Requirement

Guidelines for the QFX3008-I Interconnect Device

Cabinet size and clearance

  • The minimum depth required to accommodate a QFX3008-I Interconnect device is 39.52 in. (100.38 cm). Large cabinets improve airflow and reduce the chance of overheating.

    A U is the standard rack unit defined in Cabinets, Racks, Panels, and Associated Equipment (document number EIA-310–D) published by the Electronics Industry Association.

  • With adequate cooling air and airflow clearance, you can stack two devices in a cabinet that has at least 42 U of usable vertical space. In all cases, the rack must meet the strength requirements to support the weight of the installed devices.

Cabinet airflow requirements

When you mount the device in a cabinet, ensure that ventilation through the cabinet is sufficient to prevent overheating. Consider the following requirements list when planning for chassis cooling:

  • Ensure that the cool air supply you provide through the cabinet adequately dissipates the thermal output of the device (or devices).
  • Ensure that the cabinet allows the chassis hot exhaust air to exit the cabinet without recirculating into the device. An open cabinet (without a top or doors) that employs hot air exhaust extraction from the top allows the best airflow through the chassis. If the cabinet contains a top or doors, perforations in these elements assist with removing the hot air exhaust. For an illustration of chassis airflow, see Clearance Requirements for Airflow and Hardware Maintenance for a QFX3008-I Interconnect Device.
  • The device fans exhaust hot air through the rear of the chassis. Install the device in the cabinet in a way that maximizes the open space on the rear of the chassis. This maximizes the clearance for critical airflow.
  • Route and dress all cables to minimize the blockage of airflow to and from the chassis.
  • Ensure that the spacing of rails and adjacent racks allows for the proper clearance around the switch and rack as specified in Clearance Requirements for Airflow and Hardware Maintenance for a QFX3008-I Interconnect Device.
 

Related Documentation

  • EX Series
  • Rack-Mounting and Cabinet-Mounting Warnings
  • QFX Series
  • Rack-Mounting and Cabinet-Mounting Warnings
  • Rack Requirements for a QFX3008-I Interconnect Device
  • Chassis Physical Specifications for a QFX3008-I Interconnect Device
 

Published: 2012-03-23

 
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