Technical Documentation

Chassis Physical Specifications for a QFX3008-I Interconnect Device

The QFX3008-I Interconnect device is a rigid sheet-metal structure that houses the other switch components. Table 1 summarizes the physical specifications of the QFX3008-I Interconnect device.

Table 1: Physical Specifications of a QFX3008-I Interconnect Device

Description	Value
Chassis height	36.65 in. (93.09 cm)
Chassis width	17.3 in. (43.9 cm) excluding mounting bracket width 19.0 in. (48.3 cm) including mounting bracket width
Chassis depth	Minimum depth required for installation is 39.52 in. (100.38 cm) Chassis depth without any field-replaceable units (FRUs) installed is 32.38 in. (82.25 cm) Chassis depth from front-mounting brackets to rear of chassis is 35.10 in. (89.15 cm) Chassis depth from mid-mounting brackets to rear of chassis is 23.73 in. (60.27 cm) Maximum chassis depth with FRUs, including the optional cable manager and lockable front doors installed, is 40.37 in. (102.54 cm)
Weight	Chassis with midplane: Approximately 205 lb (93 kg) Chassis with all FRUs: Approximately 650 lb (295 kg) Note: This represents the weight of the chassis including all required and optional FRUs. This does not include optical transceivers and cabling. 16-port QSFP+ front card: 18.3 lb (8.3 kg) Control Board: 8.4 lb (3.8 kg) Rear card: 10.0 lb (4.5 kg) Side fan tray: 2.7 lb (1.2 kg) Front fan tray and front panel display: 16.7 lb (7.6 kg) Rear fan tray: 19.4 lb (8.8 kg) Power supply: 11.2 lb (5.1 kg) Wiring tray: 8.0 lb (3.6 kg)

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Chassis Physical Specifications for a QFX3008-I Interconnect Device

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Published: 2012-03-23