Clearance Requirements for Airflow and Hardware Maintenance for a QFX3008-I Interconnect Device

When planning the site for installing a QFX3008-I Interconnect device, you must allow sufficient clearance around the device.

Follow these clearance requirements:

• For the cooling system to function properly, the airflow around the chassis must be unrestricted. Do not block the air intake or exhaust areas shown in Figure 1 and Figure 2.

  The air intake to cool the front card cage and powerhouse is located below the front fan tray on the chassis. Hot air exhausts from the powerhouse at the bottom of the chassis, and above the rear fan tray at the top of the chassis.

  Figure 1: Airflow Through the Front Card Cage and Powerhouse

  

  The air intake to cool the rear card cage is located on the front sides of the chassis. Cool air is pulled in through the side fan trays. Hot air exhausts from the Control Boards and rear cards.

  Figure 2: Airflow Through the Rear Card Cage

  
• If you are mounting the device on a rack or cabinet along with other equipment, ensure that the exhaust from other equipment does not blow into the intake vents of the chassis.
• Leave at least 24 in. (61 cm) both in front of and behind the switch. Allow at least 6 in. (15.2 cm) of clearance on each side of the chassis. Leave adequate space at the front of the switch for service personnel to remove and install hardware components. NEBS GR-63 recommends that you allow at least 30 in. (76.2 cm) in front of the rack or cabinet and 24 in. (61 cm) behind the rack or cabinet. See Figure 3.

  Figure 3: Clearance Requirements for Airflow and Hardware Maintenance for a QFX3008-I Interconnect Device